TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMPS USING SAME

• Main Authors: IKUMOTO RAIHEI, KANO TOSHIKAZU, TSUJIMOTO MASANOBU
• Format: Patent
• Language: English; Korean
• Published: 30.09.2015
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

The present invention provides an electroplating bath which can be used for manufacturing a bump and, specifically, to a tin or tin alloy electroplating bath capable of having recess filling ability, and suppressing the generation of a void. According to the present invention, the electroplating bath comprises: inorganic acid, organic acid, and water-soluble salt thereof; at least one kind of a nonionic surfactant selected from a group consisting of polyoxyalkylene ether or salt thereof, and polyoxyalkylene polycyclic phenyl ether or salt thereof; and at least one kind selected from a group consisting of aliphatic aldehyde, aromatic aldehyde, aliphatic ketone, and aromatic ketone; and a leveling agent including α,β-unsaturated carboxylic acid or amide thereof, or both sides of salt thereof.