SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD
A semiconductor device structure and a manufacturing method thereof are provided. The method includes the steps of: forming a conductive pillar on a semiconductor substrate; forming a solder layer on the conductive pillar; forming a water-soluble flux on the solder layer; and reflowing the solder la...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Korean |
Published |
23.09.2015
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device structure and a manufacturing method thereof are provided. The method includes the steps of: forming a conductive pillar on a semiconductor substrate; forming a solder layer on the conductive pillar; forming a water-soluble flux on the solder layer; and reflowing the solder layer to form a solder bump on the conductive pillar, and forming a sidewall protection layer on a sidewall of the conductive pillar while the solder layer is reflowed. |
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Bibliography: | Application Number: KR20140191882 |