SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD

A semiconductor device structure and a manufacturing method thereof are provided. The method includes the steps of: forming a conductive pillar on a semiconductor substrate; forming a solder layer on the conductive pillar; forming a water-soluble flux on the solder layer; and reflowing the solder la...

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Bibliographic Details
Main Authors LEE LI GUO, LAI YI JEN, CHEN CHUN JEN, LIU YI CHEN, LIU YUNG SHENG, CHENG HSI KUEI
Format Patent
LanguageEnglish
Korean
Published 23.09.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device structure and a manufacturing method thereof are provided. The method includes the steps of: forming a conductive pillar on a semiconductor substrate; forming a solder layer on the conductive pillar; forming a water-soluble flux on the solder layer; and reflowing the solder layer to form a solder bump on the conductive pillar, and forming a sidewall protection layer on a sidewall of the conductive pillar while the solder layer is reflowed.
Bibliography:Application Number: KR20140191882