CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE, CONNECTING STRUCTURE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE
Provided are a conductive particle which can consist with low conduction resistance and high insulation reliability when being used as a conductive particle for mixing in an anisotropic conductive adhesive, and also maintain a low electrical resistance value in the case of being highly compressed, a...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English Korean |
Published |
18.09.2015
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Subjects | |
Online Access | Get full text |
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Abstract | Provided are a conductive particle which can consist with low conduction resistance and high insulation reliability when being used as a conductive particle for mixing in an anisotropic conductive adhesive, and also maintain a low electrical resistance value in the case of being highly compressed, an anisotropic conductive adhesive and a connecting structure using the conductive particle, and a method for producing a conductive particle. The conductive particle comprises a resin particle and a metal layer which is mounted on a surface of the resin particle, wherein the metal layer, in order of being close to the resin particle, has a first layer including copper, or nickel and copper and a second layer including nickel, contains grains including palladium (Pd) of 4 nm or more length from a thickness direction of the metal layer and forms protrusions on an outer surface of the metal layer. |
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AbstractList | Provided are a conductive particle which can consist with low conduction resistance and high insulation reliability when being used as a conductive particle for mixing in an anisotropic conductive adhesive, and also maintain a low electrical resistance value in the case of being highly compressed, an anisotropic conductive adhesive and a connecting structure using the conductive particle, and a method for producing a conductive particle. The conductive particle comprises a resin particle and a metal layer which is mounted on a surface of the resin particle, wherein the metal layer, in order of being close to the resin particle, has a first layer including copper, or nickel and copper and a second layer including nickel, contains grains including palladium (Pd) of 4 nm or more length from a thickness direction of the metal layer and forms protrusions on an outer surface of the metal layer. |
Author | AKAI KUNIHIKO YAMAMURA TAIZOU MATSUZAKI TOSHIAKI MATSUZAWA MITSUHARU EJIRI YOSHINORI NAKAGAWA MASASHI WATANABE YASUSHI ENOMOTO NANA |
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Snippet | Provided are a conductive particle which can consist with low conduction resistance and high insulation reliability when being used as a conductive particle... |
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SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
Title | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE, CONNECTING STRUCTURE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE |
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