CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE, CONNECTING STRUCTURE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE

• Main Authors: MATSUZAWA MITSUHARU, MATSUZAKI TOSHIAKI, ENOMOTO NANA, EJIRI YOSHINORI, WATANABE YASUSHI, NAKAGAWA MASASHI, AKAI KUNIHIKO, YAMAMURA TAIZOU
• Format: Patent
• Language: English; Korean
• Published: 18.09.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; DYES; ELECTRICITY; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

Provided are a conductive particle which can consist with low conduction resistance and high insulation reliability when being used as a conductive particle for mixing in an anisotropic conductive adhesive, and also maintain a low electrical resistance value in the case of being highly compressed, an anisotropic conductive adhesive and a connecting structure using the conductive particle, and a method for producing a conductive particle. The conductive particle comprises a resin particle and a metal layer which is mounted on a surface of the resin particle, wherein the metal layer, in order of being close to the resin particle, has a first layer including copper, or nickel and copper and a second layer including nickel, contains grains including palladium (Pd) of 4 nm or more length from a thickness direction of the metal layer and forms protrusions on an outer surface of the metal layer.