DEPOSITION SYSTEM

• Main Authors: HONG, JONG WON, KIM, CHAE WOONG, CHOI, YOUNG MOOK
• Format: Patent
• Language: English; Korean
• Published: 28.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A deposition system comprises: a plurality of process chamber groups arranged in a first direction; a carrier to transmit the process chamber groups; at least one gate valve disposed between the process chamber groups to supply a transmitting path of the carrier between the process chamber groups; a substrate which is attached to the carrier, and on which a deposition material is deposited; and a plurality of attractive levitation modules disposed to face the carrier inside the process chamber groups to transmit the carrier with an electromagnetic force. A sum total of the electromagnetic force of the attractive levitation modules overlapped with the carrier when a predetermined area of the carrier overlaps with a discontinuous section defined as an area in which a gate valve is disposed, is set more largely than a sum total of the electromagnetic force of the attractive levitation modules overlapped with the carrier when the carrier is disposed inside each of the process chamber groups.