METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS

Provided is a method for manufacturing a polishing layer for polishing a substrate, which comprises the steps of: providing a liquid prepolymer; providing multiple hollow microspheres; forming multiple exposed hollow microspheres by treating the multiple exposed hollow microspheres with a carbon dio...

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Bibliographic Details
Main Authors SARAFINAS AARON, SAIKIN ALAN, MCCLAIN GEORGE, POST ROBERT L, KOLESAR DAVID
Format Patent
LanguageEnglish
Korean
Published 27.08.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a method for manufacturing a polishing layer for polishing a substrate, which comprises the steps of: providing a liquid prepolymer; providing multiple hollow microspheres; forming multiple exposed hollow microspheres by treating the multiple exposed hollow microspheres with a carbon dioxide condition; forming a curable mixture by assembling the liquid prepolymer with multiple treated hollow microspheres; forming a cured material by making a reaction of the liquid mixture, wherein the reaction starts within 24 hours or less after formation of the multiple treated hollow microspheres; and inducing one or more polishing layer from the cured material, wherein one or more polishing layer has a polishing surface optimized for polishing a substrate.
Bibliography:Application Number: KR20150022383