METHOD OF MANUFACTURING MEMS DEVICE AND MEMS DEVICE MANUFACTURED BY USING THE SAME
The present invention relates to a MEMS device manufacturing method and a MEMS device manufactured using the method, comprising the steps of: performing oxide deposition and mask process on an upper portion of a silicon substrate, etching, and removing a photoresist, to form an oxide pattern; deposi...
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Format | Patent |
Language | English Korean |
Published |
17.08.2015
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Abstract | The present invention relates to a MEMS device manufacturing method and a MEMS device manufactured using the method, comprising the steps of: performing oxide deposition and mask process on an upper portion of a silicon substrate, etching, and removing a photoresist, to form an oxide pattern; depositing a sacrificial substance on the upper portion of the silicon substrate on which the oxide pattern is formed, and depositing polysilicon on the upper portion of the sacrificial layer substance; performing a mask process for forming a fixed structure and a movable structure on the upper portion of the polysilicon and etching the polysilicon; capping a sidewall passivation oxide film on the upper portion of the fixed structure and the movable structure, and performing plasma etching, to remove the sacrificial layer substance; and performing plasma etching in a lower silicon undercut isotropic etching manner, to expand and form a space in which the sacrificial layer substance is removed. According to the invention, it is possible to prevent an error of a vehicle operation, it is possible to improve a defect of air bag development and sensitivity, it is possible to prevent a fixation phenomenon which may occur in the MEMS device, and it is possible to fundamentally suppress the occurrence of a positive electrostatic charge. |
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AbstractList | The present invention relates to a MEMS device manufacturing method and a MEMS device manufactured using the method, comprising the steps of: performing oxide deposition and mask process on an upper portion of a silicon substrate, etching, and removing a photoresist, to form an oxide pattern; depositing a sacrificial substance on the upper portion of the silicon substrate on which the oxide pattern is formed, and depositing polysilicon on the upper portion of the sacrificial layer substance; performing a mask process for forming a fixed structure and a movable structure on the upper portion of the polysilicon and etching the polysilicon; capping a sidewall passivation oxide film on the upper portion of the fixed structure and the movable structure, and performing plasma etching, to remove the sacrificial layer substance; and performing plasma etching in a lower silicon undercut isotropic etching manner, to expand and form a space in which the sacrificial layer substance is removed. According to the invention, it is possible to prevent an error of a vehicle operation, it is possible to improve a defect of air bag development and sensitivity, it is possible to prevent a fixation phenomenon which may occur in the MEMS device, and it is possible to fundamentally suppress the occurrence of a positive electrostatic charge. |
Author | KIM, SHEUNG KI PARK, BYUNG IL JANG, SUNG TAEK PARK, CHUN BONG |
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Snippet | The present invention relates to a MEMS device manufacturing method and a MEMS device manufactured using the method, comprising the steps of: performing oxide... |
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SubjectTerms | INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING TRANSPORTING |
Title | METHOD OF MANUFACTURING MEMS DEVICE AND MEMS DEVICE MANUFACTURED BY USING THE SAME |
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