FLEXIBLE PRINTED CIRCUIT BOARD AND TOUCH SENSOR INCLUDING THE SAME

• Main Authors: YANG, DEK GIN, HONG, YUN KI, CHAE, KYOUNG SOO, WI, SUNG KWON, JEONG, GWAN HA
• Format: Patent
• Language: English; Korean
• Published: 06.08.2015
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; TRANSPORTING

One aspect of the present invention removes a connection step between a flexible printed circuit board and an electrode device by properly selecting and applying a connection unit on the bottom substrate and the top substrate of the flexible printed circuit board according to a connection position. Also, provided are the flexible printed circuit board and the touch sensor module capable of improving the operation performance of a touch sensor by improving the electrical connection reliability of the touch sensor in the touch sensor module including the flexible printed circuit board. 발명의 일측면은 연성인쇄회로기판의 접속부 상부기판 및 하부기판에서 접속위치에 따라 적절하게 선택 적용함으로써 연성인쇄회로기판과 전자기기간의 접속단차를 제거하기 위한 것이며, 또한, 연성인쇄회로기판을 포함한 터치센서 모듈에서 터치센서의 전기적 접속신뢰성을 향상시켜 터치센서 작동성능을 보다 향상시키기 위한 연성인쇄회로기판 및 이를 포함한 터치센서모듈을 제공하기 위한 것이다.