CURED PRODUCT

• Main Authors: CHOI, BUM GYU, JUNG, JAE HO, KIM, KYUNG MI, KO, MIN JIN, KIM, MIN KYOUN
• Format: Patent
• Language: English; Korean
• Published: 05.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to a cured product and a use thereof. The cured product has excellent processability, workability, and adhesive properties, etc, and does not cause white turbidity, stickiness on the surface, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and crack resistance. The cured product, for example, is applied as an encapsulment or an adhesive material of a semiconductor device, thereby providing a device having long-term reliability. 본 출원은, 경화체 및 그 용도에 관한 것이다. 경화체는, 가공성, 작업성 및 접착성 등이 우수하고, 백탁 및 표면에서의 끈적임 등이 유발되지 않는다. 경화체는 투명도, 내습성, 기계적 특성 및 균열 내성 등이 우수하다. 경화체는, 예를 들면, 반도체 소자의 봉지재나 접착 소재로 적용되어 장기 신뢰성이 우수한 소자를 제공할 수 있다.