CURED PRODUCT

• Main Authors: CHOI, BUM GYU, JUNG, JAE HO, KIM, KYUNG MI, KO, MIN JIN, KIM, MIN KYOUN
• Format: Patent
• Language: English; Korean
• Published: 05.08.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to a cured product and a use thereof. The cured product of the present invention provides a device which has minimized brightness degradation even being used for a long time, and has excellent crack resistance and excellent reliability when being applied to an optical semiconductor such as LED or the like. The cured product has excellent processability, workability, and adhesive properties, etc, and does not cause white turbidity, stickiness on the surface, etc. Moreover, the cured product has excellent high temperature heat resistance, gas barrier properties, etc. The cured product, for example, can be used as an encapsulment or an adhesive material of a semiconductor device. 본 출원은, 경화체 및 그 용도에 관한 것이다. 상기 경화체는, 예를 들어, LED 등과 같은 광반도체에 적용될 경우에, 소자를 장시간 사용하여도 휘도 저하가 최소화되며, 내크렉 특성이 우수하여, 장기 신뢰성이 우수한 소자를 제공할 수 있다. 경화체는, 가공성, 작업성 및 접착성 등이 우수하고, 백탁 및 표면에서의 끈적임 등이 유발되지 않는다. 또한, 경화체는 고온 내열성 및 가스 배리어성 등이 우수하다. 경화체는, 예를 들면, 반도체 소자의 봉지재나 접착 소재로 적용될 수 있다.