EMBEDDED PRINTED CIRCUIT SUBSTRATE

The present invention relates to an embedded printed circuit board. The embedded printed circuit board includes: an insulating substrate including a cavity; a sensor device disposed on the cavity; and an adhesive layer formed in an outside area of the cavity on the insulating substrate and on the se...

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Bibliographic Details
Main Authors PARK, CHUNG SIK, LEE, SANG MYUNG, JUNG, WON SUK, AN, YUN HO
Format Patent
LanguageEnglish
Korean
Published 05.08.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to an embedded printed circuit board. The embedded printed circuit board includes: an insulating substrate including a cavity; a sensor device disposed on the cavity; and an adhesive layer formed in an outside area of the cavity on the insulating substrate and on the sensor device. 본 발명은 임베디드 인쇄회로기판에 관한 것으로, 캐비티를 포함하는 절연 기판; 상기 캐비티에 배치되는 센서 소자; 및 상기 캐비티의 외부 영역의 상기 절연 기판과 상기 센서 소자 상에 형성되는 접착층;을 포함한다.
Bibliography:Application Number: KR20140010326