MULTI-LAYERED CERAMIC ELECTROIC COMPONENTS AND MOUNTING CIRCUIT THEREOF
The present invention provides a multilayered ceramic electronic component which includes a multilayered ceramic capacitor on which a first external electrode and a second external electrode made of conductive paste on both ends of a first ceramic body are formed and a ceramic chip which includes a...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
05.08.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a multilayered ceramic electronic component which includes a multilayered ceramic capacitor on which a first external electrode and a second external electrode made of conductive paste on both ends of a first ceramic body are formed and a ceramic chip which includes a second ceramic body which is formed by laminating a plurality of ceramic layers and is bonded on the mounting surface of the multilayered ceramic capacitor and first and second connection terminals which are formed on both ends of the second ceramic body and are connected to the first and second external electrodes, respectively. The first and second connection terminals have dual layer structures of first and second resin layers inside and first and second plating layers outside.
본 발명은, 제1 세라믹 본체의 양 단에 도전성 페이스트로 이루어진 제1 및 제2 외부 전극이 형성된 적층 세라믹 커패시터; 및 복수의 세라믹층이 적층되어 형성되며 상기 적층 세라믹 커패시터의 실장 면에 접합된 제2 세라믹 본체와, 상기 제2 세라믹 본체의 양 단에 형성되며 상기 제1 및 제2 외부 전극과 각각 접속된 제1 및 제2 접속 단자를 포함하며, 상기 제1 및 제2 접속 단자는 내측의 제1 및 제2 도전성 수지층과 외측의 제1 및 제2 도금층의 이중 층 구조를 갖는 세라믹 칩; 을 포함하는 적층 세라믹 전자 부품을 제공한다. |
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Bibliography: | Application Number: KR20140009720 |