POLISHING COMPOSITION

• Main Authors: SAKABE KOICHI, YOKOTA SHUUGO
• Format: Patent
• Language: English; Korean
• Published: 29.07.2015
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

보존 안정성이 양호하고, 화학 반응성이 부족한 연마 대상물을 고속으로 연마할 수 있는 연마용 조성물을 제공한다. 본 발명은, 유기산을 표면에 고정한 실리카와, 분자량이 2만 미만인 2가 알코올과, pH 조정제를 포함하고, pH가 6 이하인, 연마용 조성물이다. Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed. The invention is a polishing compositionwhich contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less.