MULTI-LAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Disclosed are a multi-layer ceramic substrate and a method for manufacturing the same. The multi-layer ceramic substrate comprises: a plurality of ceramic layers including a first pad electrode; an internal via formed in the ceramic layer to be electrically connected with the first pad electrode, an...

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Bibliographic Details
Main Authors KIM, YONG SUK, CHANG, BYEUNG GYU, LEE, TAEK JUNG
Format Patent
LanguageEnglish
Korean
Published 16.07.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosed are a multi-layer ceramic substrate and a method for manufacturing the same. The multi-layer ceramic substrate comprises: a plurality of ceramic layers including a first pad electrode; an internal via formed in the ceramic layer to be electrically connected with the first pad electrode, and made of a material which has lower contraction onset temperature than the ceramic layer; and an external via formed in the ceramic layer to cover an outer circumference surface of the internal via, wherein the external via comprises: a conductive material; and an additive material added in the conductive material to reduce sintering speed of the internal via by diffusing toward the internal via. 다층 세라믹 기판 및 제조 방법이 개시된다. 제1 패드전극을 포함하는 복수의 세라믹층; 상기 제1 패드전극과 전기적으로 연결되도록 상기 세라믹층 내에 형성되며, 상기 세라믹층보다 수축개시온도가 낮은 물질로 형성되는 내부비아; 및 상기 내부비아의 외주면을 커버하도록 상기 세라믹층 내에 형성되는 외부비아를 포함하고, 상기 외부비아는, 전도성물질; 및 상기 내부비아 측으로 확산되어 상기 내부비아의 소성속도를 감소시키도록 상기 전도성물질에 첨가되는 첨가물질을 포함하는 것을 특징으로 하는 다층 세라믹 기판 및 제조 방법이 제공된다.
Bibliography:Application Number: KR20140002473