METHOD FOR MANUFACTURING CONDUCTIVE PATTERN AND DEVICE HAVING CONDUCTIVE PATTERN

The present invention provides a method for forming a conductive pattern. The method for forming a conductive pattern includes: a step of forming a conductive layer on a substrate; a step of forming an organic pattern including a plurality of fillers condensed in the form of a network on the conduct...

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Bibliographic Details
Main Authors LEE, BYEONG JIN, LIM, JEE HUN, KANG, SUNG KU
Format Patent
LanguageEnglish
Korean
Published 08.07.2015
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Summary:The present invention provides a method for forming a conductive pattern. The method for forming a conductive pattern includes: a step of forming a conductive layer on a substrate; a step of forming an organic pattern including a plurality of fillers condensed in the form of a network on the conductive layer; a step of dry etching the conductive layer by using the organic pattern as a mask and forming a conductive pattern wherein the shape of the fillers condensed in the form of the network is transferred; and a step of removing the organic pattern. 도전 패턴 형성 방법은 기판 상에 도전층을 형성하는 단계, 상기 도전층 상에 네트워크 형태로 응집된 복수의 필러(filler)를 포함하는 유기 패턴을 형성하는 단계, 상기 유기 패턴을 마스크로 이용해 상기 도전층을 건식 식각하여 상기 네트워크 형태로 응집된 복수의 필러 형태가 전사된 도전 패턴을 형성하는 단계, 상기 유기 패턴을 제거하는 단계를 포함하는 도전 패턴 형성 방법을 제공한다.
Bibliography:Application Number: KR20130167497