METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device according to the embodiment of the present invention includes the steps of: forming a first wire layer to expose a first conductive layer and a first insulation layer from a surface; forming a second wire layer to expose a second conductive layer and...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
19.06.2015
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Subjects | |
Online Access | Get full text |
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