METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

A method for manufacturing a semiconductor device according to the embodiment of the present invention includes the steps of: forming a first wire layer to expose a first conductive layer and a first insulation layer from a surface; forming a second wire layer to expose a second conductive layer and...

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Bibliographic Details
Main Author KAWASAKI ATSUKO
Format Patent
LanguageEnglish
Korean
Published 19.06.2015
Subjects
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