ADHESIVE COMPOSITION AND ADHESIVE TAPE

• Main Authors: WAN HONGMEI, LI ZHOU, WU QING, KONG FANWANG, QIN LIANG
• Format: Patent
• Language: English; Korean
• Published: 17.06.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

본 발명은 조성물의 총 중량을 기준으로, (a) 5 내지 70 중량%의 에폭시 성분; (b) 5 내지 60 중량%의 열전도성 물질; (c) 0.001 내지 10 중량%의 광개시제; (d) 0 내지 40 중량%의 열가소성 중합체; (e) 0 내지 50 중량%의 하이드록실-작용성 성분; 및 (f) 0 내지 50 중량%의 할로겐 무함유 난연제를 포함하는 열전도성 접착제 조성물을 제공한다. 추가로 본 발명은 본 접착제 조성물을 포함하는 열전도성 접착 테이프를 제공한다. The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.