COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT

• Main Authors: YAMAMOTO MASAHARU, YOKOTA MASAYUKI
• Format: Patent
• Language: English; Korean
• Published: 10.06.2015
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

이 기밀 밀봉용 덮개재는, 전자 부품 수납용 패키지에 사용되는 기밀 밀봉용 덮개재이다. 기밀 밀봉용 덮개재(1)는, Ni와 Cr과 Fe를 함유하는 Ni-Cr-Fe 합금, 또는, Ni와 Cr과 Co와 Fe를 함유하는 Ni-Cr-Co-Fe 합금에 의해 구성된 기재층과, 기재층의 전자 부품 수납 부재측의 한쪽 표면에 접합되고, Ni, 또는, Ni 합금에 의해 구성된 표면층을 구비하는 클래드재에 의해 구성되어 있다. This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is constituted of a clad material including a base material layer made of an Ni-Cr-Fe alloy containing Ni, Cr and Fe or an Ni-Cr-Co-Fe alloy containing Ni, Cr, Co and Fe, and a surface layer bonded to one surface of the base material layer on a side of an electronic component containing member and made of Ni or an Ni alloy.