PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD

• Main Authors: KONDO SHINOBU, HARIMA EIJI, MITANI TSUYOSHI, FUKUDA SHINICHIROH
• Format: Patent
• Language: English; Korean
• Published: 10.06.2015
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

Provided in the present invention are a photosensitive resin composition solving solubility problem of a photopolymerization initiator, a dry film, a cured product, and a printed wire board. The present invention relates to a photosensitive resin composition including (A) a carboxylic group-containing resin, (B) a thermosetting component, (C) an inorganic filler, and (D) a photopolymerization initiator, wherein (D) the photopolymerization initiator contains (D1) a bis acyl phosphine oxide-based initiator, and (D2) a hydroxy aceto phenone-based photopolymerization initiator. 본 발명은 광중합성 개시제의 용해성 문제를 해소하여, 광경화성이 우수한 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판을 제공한다. 본 발명은 (A) 카르복실기 함유 수지, (B) 열경화성 성분, (C) 무기 충전물 및 (D) 광중합 개시제를 함유하는 감광성 수지 조성물이며, (D) 광중합 개시제가 (D1) 비스아실포스핀옥시드계 광중합 개시제 및 (D2) 히드록시아세토페논계 광중합 개시제를 함유하는 감광성 수지 조성물에 관한 것이다.