MOLD DEVICE FOR MANUFACTURING FOIL PRODUCT

A mold device comprises: an upper mold; an upper die punch to be moved with the upper mold; a lower mold; a lower die pad which is engaged with the lower mold to be moved and which is moved by being pushed by the upper die punch; and a support unit to support the lower die pad upwards. The support u...

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Bibliographic Details
Main Author JUNG, CHANG MO
Format Patent
LanguageEnglish
Korean
Published 08.06.2015
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Summary:A mold device comprises: an upper mold; an upper die punch to be moved with the upper mold; a lower mold; a lower die pad which is engaged with the lower mold to be moved and which is moved by being pushed by the upper die punch; and a support unit to support the lower die pad upwards. The support unit includes upper and lower cylinders to support the lower die pad by turns using the pressure of air. 금형 장치는, 상부 금형, 상기 상부 금형과 함께 이동하도록 설치되는 상형 펀치, 하부 금형, 상기 하부 금형에 이동 가능하게 체결되며 상기 상형 펀치에 의해 밀려 이동될 수 있도록 형성되는 하형 패드, 그리고 상기 하형 패드를 상 방향으로 지지하는 지지 유닛을 포함한다. 상기 지지 유닛은 상기 하형 패드를 공기의 압력에 의해 차례로 지지하는 상부 실린더 및 하부 실린더를 포함한다.
Bibliography:Application Number: KR20130146979