WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF

• Main Authors: MECCIA JOHN, WASKI DANIEL, HUANG TIANJIAN, THOMPSON KRISTINA
• Format: Patent
• Language: English; Korean
• Published: 04.06.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

유제 고분자 및 미소구체를 포함하는 접착제 조성물 및 그것으로부터 제조된 물품이 제공된다. 접착제는 전체적인 기재의 평량을 감소시키면서도 충분한 강도 및 열 절연을 제공하는 소비재를 위한 포장물에 특히 적합하다. The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.