SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING BALL LAND, AND THE METHODS OF FABRICATING THE SAME

The substrate produced by the present technology includes a ball land pad part which is formed on the surface of the first side of a core, an opening part which exposes the ball land pad part by passing through the core, a first dummy ball land which is composed of a plurality of sub patterns which...

Full description

Saved in:
Bibliographic Details
Main Authors YOO, JONG WOO, CHUNG, QWAN HO
Format Patent
LanguageEnglish
Korean
Published 03.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The substrate produced by the present technology includes a ball land pad part which is formed on the surface of the first side of a core, an opening part which exposes the ball land pad part by passing through the core, a first dummy ball land which is composed of a plurality of sub patterns which are arranged on the second side facing the first side of the core to surround the opening part, and a first vent hole which is arranged between the adjacent sub patterns. 본 기술의 기판은, 코어의 제1면 표면에 형성된 볼랜드 패드부; 코어를 관통하면서 볼랜드 패드부를 노출시키는 개구부; 코어의 제1면과 대향하는 제2면에 개구부를 둘러싸게 배치된 복수 개의 서브 패턴들로 구성된 제1 더미 볼랜드; 및 인접하는 서브 패턴들 사이에 배치된 제1 벤트홀을 포함한다.
Bibliography:Application Number: KR20130144115