Method for cutting a single crystal

A method for cutting a single crystal having a first polar axis includes the steps of arranging the single crystal relative to a cutting tool in such a way that the first polar axis is oriented perpendicular to an intended cutting plane; arranging at least one further single crystal having a second...

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Bibliographic Details
Main Authors WINNACKER ALBRECHT, BICKERMANN MATTHIAS, EPELBAUM BORIS, SEITZ ULRICH, HEIMANN PAUL, FILIP OCTAVIAN
Format Patent
LanguageEnglish
Korean
Published 18.03.2015
Subjects
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:A method for cutting a single crystal having a first polar axis includes the steps of arranging the single crystal relative to a cutting tool in such a way that the first polar axis is oriented perpendicular to an intended cutting plane; arranging at least one further single crystal having a second polar axis in such a way that the first and the second polar axis are oriented substantially parallel but opposite one another; and simultaneously guiding a cutting tool through the single crystal and the at least one further single crystal along the intended cutting plane.
Bibliography:Application Number: KR20157000738