CHEMICAL MECHANICAL POLISHING PAD

Provided is a chemical mechanical polishing pad which includes a polishing layer; a hardened layer; and includes a hot melt adhesive of combining the polishing layer and the hardened layer. Here, the polishing layer includes specific gravity of more than 0.6; a shore D hardness of 60 to 90; fracture...

Full description

Saved in:
Bibliographic Details
Main Authors JOHN G. NOWLAND, DARRELL STRING, JAMES MURNANE, MOHAMMAD T. ISLAM, FENGJI YEH, MATTHEW RICHARD VANHANEHEM, MARTY DEGROOT, BAINIAN QIAN, MICHELLE K. JENSEN, JEFFREY JAMES HENDRON
Format Patent
LanguageEnglish
Korean
Published 11.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

Abstract Provided is a chemical mechanical polishing pad which includes a polishing layer; a hardened layer; and includes a hot melt adhesive of combining the polishing layer and the hardened layer. Here, the polishing layer includes specific gravity of more than 0.6; a shore D hardness of 60 to 90; fracture elongation of 100 to 300%; and shows specific combination of initial hydrolysis stability and long-term hydrolysis instability.
AbstractList Provided is a chemical mechanical polishing pad which includes a polishing layer; a hardened layer; and includes a hot melt adhesive of combining the polishing layer and the hardened layer. Here, the polishing layer includes specific gravity of more than 0.6; a shore D hardness of 60 to 90; fracture elongation of 100 to 300%; and shows specific combination of initial hydrolysis stability and long-term hydrolysis instability.
Author JAMES MURNANE
DARRELL STRING
MICHELLE K. JENSEN
BAINIAN QIAN
JEFFREY JAMES HENDRON
MARTY DEGROOT
MOHAMMAD T. ISLAM
MATTHEW RICHARD VANHANEHEM
FENGJI YEH
JOHN G. NOWLAND
Author_xml – fullname: JOHN G. NOWLAND
– fullname: DARRELL STRING
– fullname: JAMES MURNANE
– fullname: MOHAMMAD T. ISLAM
– fullname: FENGJI YEH
– fullname: MATTHEW RICHARD VANHANEHEM
– fullname: MARTY DEGROOT
– fullname: BAINIAN QIAN
– fullname: MICHELLE K. JENSEN
– fullname: JEFFREY JAMES HENDRON
BookMark eNrjYmDJy89L5WRQdPZw9fV0dvRR8HV19nD0AzMD_H08gz08_dwVAhxdeBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGhqYGBkZmlgbGjMXGqAGLtJHc
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID KR20150026903A
GroupedDBID EVB
ID FETCH-epo_espacenet_KR20150026903A3
IEDL.DBID EVB
IngestDate Fri Jul 19 11:31:21 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
Korean
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_KR20150026903A3
Notes Application Number: KR20140112165
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150311&DB=EPODOC&CC=KR&NR=20150026903A
ParticipantIDs epo_espacenet_KR20150026903A
PublicationCentury 2000
PublicationDate 20150311
PublicationDateYYYYMMDD 2015-03-11
PublicationDate_xml – month: 03
  year: 2015
  text: 20150311
  day: 11
PublicationDecade 2010
PublicationYear 2015
RelatedCompanies DOW GLOBAL TECHNOLOGIES LLC
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC
RelatedCompanies_xml – name: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC
– name: DOW GLOBAL TECHNOLOGIES LLC
Score 2.9373834
Snippet Provided is a chemical mechanical polishing pad which includes a polishing layer; a hardened layer; and includes a hot melt adhesive of combining the polishing...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
Title CHEMICAL MECHANICAL POLISHING PAD
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150311&DB=EPODOC&locale=&CC=KR&NR=20150026903A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSQb2OSyANbNucpphki6wCkjWtUw1NNQ1S7E0SQHmTDPTNNBuZF8_M49QE68I0wgmhhzYXhjwOaHl4MMRgTkqGZjfS8DldQFiEMsFvLayWD8pEyiUb-8WYuuiBu0dA1s3xsC86-Jk6xrg7-LvrObsbOsdpOYXBJED9jcsDYwdmRlYgQ1pc3C3LcwJtC-lALlScRNkYAsAmpdXIsTAlJ0vzMDpDLt7TZiBwxc65Q1kQnNfsQiDIuz8AgVfV2cPRz8wM8AfOuakEODoIsqg7OYa4uyhC7QrHu61eO8gZIcZizGwADv9qRIMCkmgq78TUw2TzCwsTczTkhITLY1N0wyTjU2STZKTEg0kGWTwmSSFX1qagQvEBa2lMjSUYWApKSpNlQVWriVJcuAwAQBzq3hL
link.rule.ids 230,309,783,888,25577,76883
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5qFetNq-KjakTJLdglD5NDkDQPomkehCi9hew2AVFssRH_vpM10Z56W3ZgX_DtzDc7Mwtwy5Bz6KiZJVYRKqEKYJJREiJpc0OZIzI1tWqykcNI85-Vp5k668F7lwvD64R-8-KIiCiGeK_5fb38d2I5PLZydUdfsWvx4GWmI7bsGK0bGbHrTEw3iZ3YFm3bDFIxSn9lyDeMsWxtwTYa2TonSy-TJi9lua5UvH3YSXC8j_oAem-LIQzs7u-1IeyG7ZM3Nlv0rQ7huqtfIISu7VsRbyZx63MSEss5ghvPzWxfwrnyv63lQbq-MPkY-kj6yxMQaPP1d1ESqumGcl_RojBktSJMVpjCaDE-hdGmkc42i69g4GfhNJ8-RsE57DWiJq6KkBH068-v8gIVbU0v-fn8AD97ezs
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=CHEMICAL+MECHANICAL+POLISHING+PAD&rft.inventor=JOHN+G.+NOWLAND&rft.inventor=DARRELL+STRING&rft.inventor=JAMES+MURNANE&rft.inventor=MOHAMMAD+T.+ISLAM&rft.inventor=FENGJI+YEH&rft.inventor=MATTHEW+RICHARD+VANHANEHEM&rft.inventor=MARTY+DEGROOT&rft.inventor=BAINIAN+QIAN&rft.inventor=MICHELLE+K.+JENSEN&rft.inventor=JEFFREY+JAMES+HENDRON&rft.date=2015-03-11&rft.externalDBID=A&rft.externalDocID=KR20150026903A