PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

Provided in the present invention are an alkali-developed photosensitive resin composition generating less out gas and having excellent drying properties and developing properties, a dry film including the composition, a cured product of the same, and a printed wiring board including the cured produ...

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Bibliographic Details
Main Authors KONDO SHINOBU, HARIMA EIJI, MITANI TSUYOSHI, FUKUDA SHINICHIROH
Format Patent
LanguageEnglish
Korean
Published 11.03.2015
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:Provided in the present invention are an alkali-developed photosensitive resin composition generating less out gas and having excellent drying properties and developing properties, a dry film including the composition, a cured product of the same, and a printed wiring board including the cured product. The composition is an alkali-developed photosensitive resin composition containing (A) a carboxyl group contained resin; (B) a photopolymerization initiator, (C) an epoxy resin, and (D) a (meth)acryl monomer, containing acyl phosphinoxide-based photopolymerization initiator as (B) photopolymerization initiator, and containing an bisphenol A nobolak-type epoxy resin as (C) epoxy resin.
Bibliography:Application Number: KR20140088911