METHOD FOR MANUFACTURING A MEMS DEVICE AND MEMS DEVICE

The present invention relates to a method for manufacturing an MEMS device using a sacrificial layer and sacrificial layer etching and to an MEMS device. The method for manufacturing the MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the...

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Bibliographic Details
Main Authors GLACER CHRISTOPH, PIRK SOENKE, DEHE ALFONS
Format Patent
LanguageEnglish
Korean
Published 06.03.2015
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:The present invention relates to a method for manufacturing an MEMS device using a sacrificial layer and sacrificial layer etching and to an MEMS device. The method for manufacturing the MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot protruding from the sacrificial layer. The sacrificial layer is removed by exposing the sacrificial layer to an etching agent that is introduced through the cavity.
Bibliography:Application Number: KR20140110784