INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS HAVING THE SAME

Provided in the present invention are an insulating resin composition for a printed circuit board and a product using the same. Specifically, the present invention relates to an insulating resin composition for a printed circuit board including a naphthalene-based epoxy resin of 4-fucntiaonl group w...

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Bibliographic Details
Main Authors KIM, JIN YOUNG, MOON, JIN SEOK, LEE, HYUN JUN, YUN, GEUM HEE, YOO, SEONG HYUN
Format Patent
LanguageEnglish
Korean
Published 06.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:Provided in the present invention are an insulating resin composition for a printed circuit board and a product using the same. Specifically, the present invention relates to an insulating resin composition for a printed circuit board including a naphthalene-based epoxy resin of 4-fucntiaonl group with improved thermal expansion coefficient and glass transition temperature properties, and to a prepreg and a printed circuit board as products using the same.
Bibliography:Application Number: KR20130101246