PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

The present invention relates to a printed circuit board and a manufacturing method thereof. A method of manufacturing a printed circuit board includes a step of coating the upper side of a substrate having a circuit pattern with a first solder resist; a step of removing the first solder resist of a...

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Bibliographic Details
Main Authors HONG, MYEONG HO, LIM, YOUNG KYU, LEE, CHANG BO, HONG, DAE JO
Format Patent
LanguageEnglish
Korean
Published 06.03.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a printed circuit board and a manufacturing method thereof. A method of manufacturing a printed circuit board includes a step of coating the upper side of a substrate having a circuit pattern with a first solder resist; a step of removing the first solder resist of a residual part except a first specific region by performing a first developing process after the substrate coated with the first solder resist is exposed; a step of coating the upper side of the substrate with second solder resist which is different from the first solder resist remaining on the first region; and a step of removing the second solder resist of the residual part except the second specific region by performing a second developing process after the substrate coated with the second solder resist is exposed.
Bibliography:Application Number: KR20130101241