LIGHT EMITTING DEVICE PACKAGE INCLUDING AND METHOD FOR MANUFACTURING THE SAME

A light emitting device package according to an embodiment comprises: a light emitting device; a substrate including a pad unit; a bump electrically connecting the light emitting device with the pad unit. The light emitting device includes: a sapphire substrate; a light emitting structure layer form...

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Bibliographic Details
Main Author HONG, EUN JU
Format Patent
LanguageEnglish
Korean
Published 02.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light emitting device package according to an embodiment comprises: a light emitting device; a substrate including a pad unit; a bump electrically connecting the light emitting device with the pad unit. The light emitting device includes: a sapphire substrate; a light emitting structure layer formed on a first surface of the sapphire substrate, and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; and first and second electrodes connected to the first and second conductive semiconductor layers respectively. Uneven patterns are regularly formed on a second surface of the sapphire substrate which is opposite to the light emitting structure layer.
Bibliography:Application Number: KR20130098666