HEAT DISSIPATION STRUCTURE OF HEAT SPREADING DEVICE WITH HIGH HEAT DISSIPATING FUNCTION

The present invention relates to a heat dissipation structure of a heat spreading device with a high heat dissipating function to improve heat dissipating performance by absorbing heat generated in a heating component and spreading it to a wide area, through a heat dissipation structure which is mad...

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Bibliographic Details
Main Authors LEE, JIN SEOK, YEE, YOUNG JOO
Format Patent
LanguageEnglish
Korean
Published 21.01.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a heat dissipation structure of a heat spreading device with a high heat dissipating function to improve heat dissipating performance by absorbing heat generated in a heating component and spreading it to a wide area, through a heat dissipation structure which is made of a phase change material which is filled in the pore space of a porous structure. A heat dissipation structure of a heat spreading device with a high heat dissipating function according to the present invention comprises a porous structure which conducts heat; and a phase change material which is filled in the pore space of the porous structure.
Bibliography:Application Number: KR20130082361