APPARATUS FOR SHAKING NOZZLE OF PLATING TANK AND SPRAY METHOD USING THE SAME

The present invention relates to an apparatus for shaking a nozzle of a plating tank, and a spray method using the same. More specifically, the said invention relates to an apparatus for shaking a nozzle of a plating tank which can evenly spray a plating liquid on the entire substrate, and a spray m...

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Bibliographic Details
Main Authors KIM, NAM SUNG, KIM, DONG SO
Format Patent
LanguageEnglish
Korean
Published 02.12.2014
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention relates to an apparatus for shaking a nozzle of a plating tank, and a spray method using the same. More specifically, the said invention relates to an apparatus for shaking a nozzle of a plating tank which can evenly spray a plating liquid on the entire substrate, and a spray method using the same. The apparatus for shaking a nozzle of the present invention comprises: a plating tank wherein plating fluid is received; a pipe portion disposed in the internal of the plating tank to spray the plating fluid to the substrate through the nozzle; and a moving portion to move the pipe portion to the substrate, wherein the flowing portion reciprocates the nozzle in the upper and lower direction.
Bibliography:Application Number: KR20130057741