PROTECTIVE FILM FOR SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

The present invention provides a protective film for semiconductor wafers which is provided with a base film and a protective membrane formed on the upper side of the base film, wherein the protective film for a semiconductor wafer is characterized in that the protective membrane contains components...

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Bibliographic Details
Main Author ICHIROKU NOBUHIRO
Format Patent
LanguageEnglish
Korean
Published 19.11.2014
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention provides a protective film for semiconductor wafers which is provided with a base film and a protective membrane formed on the upper side of the base film, wherein the protective film for a semiconductor wafer is characterized in that the protective membrane contains components (A)-(E) below. (A) 100 parts by mass of at least one type of resin selected from the group consisting of phenoxy resins, polyimide resins, and (meth)acrylic resins; (B) 5-200 parts by mass of an epoxy resin; (C) 100-400 parts by mass of a filler other than a fibrous inorganic filler; (D) a catalytic quantity of an epoxy resin curing catalyst; and (E) 25-5000 parts by mass of a fibrous inorganic filler. A semiconductor wafer protective film having excellent cutting properties, and a highly productive method for manufacturing semiconductor chips, are provided thereby.
Bibliography:Application Number: KR20147022574