METHOD FOR FORMING HOLE IN SUBSTRATE AND APPARATUS FOR FORMING HOLE IN SUBSTRATE

• Main Authors: JANG, JAE HOON, KWON, SOON CHUL
• Format: Patent
• Language: English; Korean
• Published: 17.11.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Provided by an embodiment of the present invention is a method to form a hole in a substrate which: includes a base member including glass fiber and a resin material; and has a conductive layer formed on the base member. The substrate hole forming method includes: a step of exposing a part of a base member by removing a part to form a hole from a part of a conductive layer; a primary resin removing step of removing a resin material by spraying first resin etching liquid to a part of the exposed base member by using a first flow device while immersing a substrate in the first resin etching liquid; a glass fiber removing step of removing glass fiber of the part of the exposed base member by spraying glass fiber etching liquid to the substrate; and a secondary resin removing step of removing the resin material by spraying second resin etching liquid to the exposed base member by using a second flow device while immersing the substrate in the second resin etching liquid.