PROCESSING FLEXIBLE GLASS WITH A CARRIER

• Main Authors: THOMAS JOHN CHRISTOPHER, KANG KIAT CHYAI, ZHANG JIAN ZHI JAY, BOOKBINDER DANA CRAIG, MANLEY ROBERT GEORGE, ABRAMOV ANATOLI ANATOLYEVICH, DOMEY JEFFREY JOHN, CHUANG TA KO, ENICKS DARWIN GENE, KUO KUAN TING, LIN JEN CHIEH, KEMMERER MARVIN WILLIAM, BELLMAN ROBERT ALAN, GASKILL LINDA, TSENG PEI LIEN
• Format: Patent
• Language: English; Korean
• Published: 06.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CONVEYING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GLASS; HANDLING THIN OR FILAMENTARY MATERIAL; JOINING GLASS TO GLASS OR OTHER MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; SOLDERING OR UNSOLDERING; STORING; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method of removing a desired part of a thin sheet (20) from a thin sheet bonded to a carrier (10) by a bonded area (40) that surrounds a non-bonded area (50), wherein the method includes forming a perimeter vent (60) defining a perimeter of the desired part (56), wherein the perimeter vent is disposed within the non-bonded area and has a depth.. 50% of the thickness (22) of the thin sheet. Prior to removing the desired part, a device may be processed onto the thin sheet. In some processes, the carrier is diced so it may be processed in smaller sizes, yet maintains a hermetically sealed edge. After dicing, an additional part of the device may be processed onto the thin sheet, and the desired part is removed by removing a desired part of the thin sheet from the carrier.