ELECTRICAL SYSTEM AND CORE MODULE THEREOF

Disclosed is a core module comprising: a package substrate having multiple pads; a first component which is connected to the pads of the package substrate corresponding to the first component through multiple first joint parts; a second component which is connected to the pads of the package substra...

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Bibliographic Details
Main Authors SHAUE GAN HOW, CHANG CHENG YI, YANG CHIH KUANG, GUU YEONG YAN
Format Patent
LanguageEnglish
Korean
Published 03.11.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a core module comprising: a package substrate having multiple pads; a first component which is connected to the pads of the package substrate corresponding to the first component through multiple first joint parts; a second component which is connected to the pads of the package substrate corresponding to the first component through multiple second joint parts; and a third component which is connected to the pads of the package substrate corresponding to the third component through multiple third joint parts. The first component is located on the second component on the lower package substrate. The first, second, and third components are electrically connected through the package substrate and are molded through a main molding material.
Bibliography:Application Number: KR20140045232