CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING A PROTEIN

Chemical mechanical polishing composition is provided. The composition comprises (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a protein, and (C) an aqueous medium.

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Bibliographic Details
Main Authors LI YUZHUO, LANGE ROLAND, NOLLER BASTIAN MARTEN, LAUTER MICHAEL
Format Patent
LanguageEnglish
Korean
Published 17.10.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Chemical mechanical polishing composition is provided. The composition comprises (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a protein, and (C) an aqueous medium.
Bibliography:Application Number: KR20147024959