COPPER ALLOY STRIP FOR LEAD FRAME OF LED

According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of a lead frame including a Cu-Fe based copper alloy strip, and the high brightness of an LED package can be realized by improving the reflecta...

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Main Authors MIWA YOSUKE, MATSUSHITA HIDEKI, NISHIMURA MASAYASU, MASAGO YASUSHI
Format Patent
LanguageEnglish
Korean
Published 08.10.2014
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Abstract According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of a lead frame including a Cu-Fe based copper alloy strip, and the high brightness of an LED package can be realized by improving the reflectance of an Ag-plated reflective layer formed on the surface of the lead frame. Concave parts are densely formed on the surface of the Cu-Fe based copper alloy strip, in which the concave part has surface roughness, 0.2 μm or less of Ra, 1.2 μm or less of Rz_JIS, and 1.5 μm or less of Rz in a rolling vertical direction, an average length of 2-100 μm in a rolling horizontal direction, an average length of 1-30 μm in the rolling vertical direction, and the maximum depth of 400 nm or less in the rolling horizontal direction. In this case, Ra, Rz_JIS, and Rz represent arithmetic average roughness, ten-point average roughness, and the maxim height roughness, respectively. The Cu-Fe based copper alloy strip contains 1.8-2.6 mass% of Fe, 0.005-0.20 mass% of P, and 0.01-0.50 mass% of Zn, or contains 0.01-0.5 mass% of Fe, 0.01-0.20 mass% of P, 0.01-1.0 mass% of Zn, 0.01-0.15 mass% of Sn, and a remainder substantially consisting of Cu and an inevitable material.
AbstractList According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of a lead frame including a Cu-Fe based copper alloy strip, and the high brightness of an LED package can be realized by improving the reflectance of an Ag-plated reflective layer formed on the surface of the lead frame. Concave parts are densely formed on the surface of the Cu-Fe based copper alloy strip, in which the concave part has surface roughness, 0.2 μm or less of Ra, 1.2 μm or less of Rz_JIS, and 1.5 μm or less of Rz in a rolling vertical direction, an average length of 2-100 μm in a rolling horizontal direction, an average length of 1-30 μm in the rolling vertical direction, and the maximum depth of 400 nm or less in the rolling horizontal direction. In this case, Ra, Rz_JIS, and Rz represent arithmetic average roughness, ten-point average roughness, and the maxim height roughness, respectively. The Cu-Fe based copper alloy strip contains 1.8-2.6 mass% of Fe, 0.005-0.20 mass% of P, and 0.01-0.50 mass% of Zn, or contains 0.01-0.5 mass% of Fe, 0.01-0.20 mass% of P, 0.01-1.0 mass% of Zn, 0.01-0.15 mass% of Sn, and a remainder substantially consisting of Cu and an inevitable material.
Author MASAGO YASUSHI
NISHIMURA MASAYASU
MIWA YOSUKE
MATSUSHITA HIDEKI
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Snippet According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of...
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SubjectTerms ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
INSULATORS
METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TREATMENT OF ALLOYS OR NON-FERROUS METALS
Title COPPER ALLOY STRIP FOR LEAD FRAME OF LED
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