COPPER ALLOY STRIP FOR LEAD FRAME OF LED

According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of a lead frame including a Cu-Fe based copper alloy strip, and the high brightness of an LED package can be realized by improving the reflecta...

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Bibliographic Details
Main Authors MIWA YOSUKE, MATSUSHITA HIDEKI, NISHIMURA MASAYASU, MASAGO YASUSHI
Format Patent
LanguageEnglish
Korean
Published 08.10.2014
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Summary:According to the present invention, the heat radiation property of an LED package can be improved by improving the conductivity and the thermal conductivity of a lead frame including a Cu-Fe based copper alloy strip, and the high brightness of an LED package can be realized by improving the reflectance of an Ag-plated reflective layer formed on the surface of the lead frame. Concave parts are densely formed on the surface of the Cu-Fe based copper alloy strip, in which the concave part has surface roughness, 0.2 μm or less of Ra, 1.2 μm or less of Rz_JIS, and 1.5 μm or less of Rz in a rolling vertical direction, an average length of 2-100 μm in a rolling horizontal direction, an average length of 1-30 μm in the rolling vertical direction, and the maximum depth of 400 nm or less in the rolling horizontal direction. In this case, Ra, Rz_JIS, and Rz represent arithmetic average roughness, ten-point average roughness, and the maxim height roughness, respectively. The Cu-Fe based copper alloy strip contains 1.8-2.6 mass% of Fe, 0.005-0.20 mass% of P, and 0.01-0.50 mass% of Zn, or contains 0.01-0.5 mass% of Fe, 0.01-0.20 mass% of P, 0.01-1.0 mass% of Zn, 0.01-0.15 mass% of Sn, and a remainder substantially consisting of Cu and an inevitable material.
Bibliography:Application Number: KR20140035551