IN-LINE SPUTTERING APPARATUS FOR UNIFORM DEPOSITION

• Main Authors: WOO, SANG ROK, KIM, BUN JOONG
• Format: Patent
• Language: English; Korean
• Published: 08.10.2014
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present disclosure relates to an in-line sputtering apparatus for uniform deposition. In particular, the in-line sputtering apparatus enables uniform deposition of a thin film which is necessary for a substrate by providing a ground plate on the rear of a position of a deposition process chamber, to where a substrate carrier is transferred, in order to uniformize potential distribution on the substrate. The in-line sputtering apparatus according to the present invention can perform uniform deposition of a thin film which is necessary for a substrate by uniformizing potential distribution on the substrate during the deposition process.