SINGLE-PACKAGE PHASED ARRAY MODULE WITH INTERLEAVED SUB-ARRAYS
An embodiment of the present invention discloses a single package communications device including an antenna module which has a plurality of independently selectable antenna device arrays. The antenna devices of different arrays can transmit or/and receive data signals within different signal angle...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
23.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | An embodiment of the present invention discloses a single package communications device including an antenna module which has a plurality of independently selectable antenna device arrays. The antenna devices of different arrays can transmit or/and receive data signals within different signal angle ranges. A communications device can additionally include a module separately activating each of the arrays. In a plurality of embodiments, an RF communications module can be included in the package of the communications device. In a plurality of embodiments, the RF communications module can use the arrays of the antenna devices to communicate in an mm-wave network. |
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Bibliography: | Application Number: KR20140029281 |