SEMICONDUCTOR TEST DEVICE AND METHOD FOR FABRICATING THE SAME

• Main Authors: HWANG, HEE JUNG, CHOI, MI NA, CHO, EUN SEOK, KIM, JI CHUL, BAE, SE RAN
• Format: Patent
• Language: English; Korean
• Published: 03.09.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

A semiconductor test device is provided. The semiconductor test device may comprise a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell, wherein the first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and configured to be electrically connected to the first bumps, which are electrically connected to the first heater and the first sensor.