SEMICONDUCTOR TEST DEVICE AND METHOD FOR FABRICATING THE SAME

A semiconductor test device is provided. The semiconductor test device may comprise a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell, wherein the first thermal test flip chip cell may include a pl...

Full description

Saved in:
Bibliographic Details
Main Authors HWANG, HEE JUNG, CHOI, MI NA, CHO, EUN SEOK, KIM, JI CHUL, BAE, SE RAN
Format Patent
LanguageEnglish
Korean
Published 03.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
Online AccessGet full text

Cover

More Information
Summary:A semiconductor test device is provided. The semiconductor test device may comprise a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell, wherein the first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and configured to be electrically connected to the first bumps, which are electrically connected to the first heater and the first sensor.
Bibliography:Application Number: KR20130020636