SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

The present invention suggests a semiconductor device comprising a substrate; a buffer layer formed on the substrate for alleviating stress exerted on the plate when cutting the substrate; and an element layer formed on the buffer layer, and including either one of at least one layer of an insulatin...

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Bibliographic Details
Main Authors KIM, DEOK HOON, CHO, YOUNG SANG
Format Patent
LanguageEnglish
Korean
Published 01.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention suggests a semiconductor device comprising a substrate; a buffer layer formed on the substrate for alleviating stress exerted on the plate when cutting the substrate; and an element layer formed on the buffer layer, and including either one of at least one layer of an insulating layer or at least one layer of a conductive layer, and a method for manufacturing the same.
Bibliography:Application Number: KR20130018391