PHOTOSENSITIVE COMPOSITION, RESIN COMPOSITION, CURED FILM AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT

The objective of the present invention is to improve the curing properties of a resin composition and a photosensitive composition appropriately used for forming a surface passivation layer and an insulating interlayer included in an electronic part and the like, and to decrease internal stress rema...

Full description

Saved in:
Bibliographic Details
Main Authors HANAMURA MASAAKI, SAKURAI TOMOHIKO
Format Patent
LanguageEnglish
Korean
Published 29.08.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:The objective of the present invention is to improve the curing properties of a resin composition and a photosensitive composition appropriately used for forming a surface passivation layer and an insulating interlayer included in an electronic part and the like, and to decrease internal stress remaining in a substrate when a cured layer is formed on the substrate using the compositions. A photosensitive composition includes (A) a resin containing a phenolic hydroxide group, (B1) a cross-linking agent containing at least two oxazoline groups, (B2) a cross-linking agent containing at least two groups represented by -CH_2OR (where R is a hydrogen atom, a C1-C10 alkyl group or acetyl group), and (C) a photosensitive acid generator.
Bibliography:Application Number: KR20130163538