LASER REFLECTOMETRY FOR SUBSTRATE PROCESSING

Embodiments of the present invention relate to methods and apparatus for control of laser devices and safety features related to utilization of laser devices in substrate processing systems. In one embodiment, a system for processing a substrate is provided. The system includes a chamber having a pr...

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Bibliographic Details
Main Author MOFFITT THEODORE P
Format Patent
LanguageEnglish
Korean
Published 14.08.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of the present invention relate to methods and apparatus for control of laser devices and safety features related to utilization of laser devices in substrate processing systems. In one embodiment, a system for processing a substrate is provided. The system includes a chamber having a processing volume, a first laser device to emit a beam at a first wavelength into the processing volume, and a second laser device to emit a beam at a second wavelength into the processing volume, wherein the second wavelength is different than the first wavelength, and the second laser device comprises a filter adapted to attenuate one or both of the first wavelength and the second wavelength.
Bibliography:Application Number: KR20147016253