DEPOSITION APPARATUS AND EVAPORATION SOURCE USED FOR DEPOSITION APPARATUS

• Main Authors: MIYAKE TATSUYA, TAMAKOSHI TAKESHI, OGATA TOMOHIKO, YAMAMOTO KENICHI, YAZAKI AKIO, MATSUZAKI EIJI, KUSUNOKI TOSHIAKI, MATSUURA HIROYASU
• Format: Patent
• Language: English; Korean
• Published: 28.07.2014
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided are a deposition device capable of performing stable deposition for a long time and an evaporation source capable of stably receiving a large amount of Al as a deposition material. The deposition device according to the present invention comprises a deposition source (30) for depositing a substrate and a process chamber in which the evaporation source (30) is stored and to which the substrate is transferred. The evaporation source (30) has a crucible (10). The crucible (10) comprises a material receiving part (11) to which solid Al materials (2) are supplied; a melting part (12) installed close to the material receiving part (11) and heating and melting the Al materials (2) supplied from the material receiving part (11) to make molten liquid (1); and an evaporation part (13) installed close to the melting part (12) and heating the molten liquid (1) supplied from the melting part (12) to generate steam.