POLYAMIC ACID SOLUTION AND POLYIMIDE FILM COMPRISING THE POLYAMIC ACID SOLUTION

• Main Authors: MYUNG, DO, OH, HYUN SEOK, AHN, HUNG KUN, CHANG, SUNG HWA, KIM, JUNG BUM
• Format: Patent
• Language: English; Korean
• Published: 23.07.2014
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to a polyamic acid solution and a polyimide resin film manufactured by using the same. The polyamic acid solution of the present invention includes dianhydride containing a 4-(trifluoromethyl) pyromellitic dianhydride; a fluorinated diamine; and an organic solvent.