TUBULAR TARGET

• Main Authors: DRONHOFER ANDRE, WILL TOBIAS, LINKE CHRISTIAN, WOLF HARTMUT, ABENTHUNG PETER, KOECK WOLFGANG
• Format: Patent
• Language: English; Korean
• Published: 22.07.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A tubular target is formed of refractory metal or a refractory metal alloy. The target has at least one tubular portion X with a relative density RDx and at least one tubular portion Y with a relative density RDy. At least one tubular portion X has, at least in some regions, a larger outer diameter than a tubular portion Y at least in some regions. A density ratio satisfies the relation (RDy−RDx)/RDy 0.001. There is also described a method for producing a tubular target from refractory metal or refractory metal alloy by sintering and local deformation of different degree. The tubular target has a more uniform sputter removal over the entire surface area compared with prior tubular targets. The tubular targets do not exhibit any tendency to arcing or to particle regeneration.