APPARATUS FOR CUTTING A WAFER

The present invention relates to a wafer cutting device. The present invention comprises a loading stage including a body part with a wafer mounting part in which a wafer is mounted and a first position setting part formed on the body part; a handling cap including a coupling part with a second posi...

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Bibliographic Details
Main Authors EOM, DAE YOUNG, KIM, JIN WAN, LEE, KYUNG JAE, JEON, MIN HWAN
Format Patent
LanguageEnglish
Korean
Published 16.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a wafer cutting device. The present invention comprises a loading stage including a body part with a wafer mounting part in which a wafer is mounted and a first position setting part formed on the body part; a handling cap including a coupling part with a second position setting part setting a position by being coupled to the first position setting part and a guide body part connected to the coupling part and has the penetrated inside; and a cutter moving along the guide body part and cutting the wafer put on the wafer seating part of the loading stage. The present invention has a simple configuration, cheap production costs, and a small size so as to require less installation space. Further, according to the present invention, the wafer can be precisely cut in a predetermined size and be easily cut.
Bibliography:Application Number: KR20130002150